摘要
Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder. The effects of Ag particle addition on the microstructure of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound （IMC） layer of the Sn-0.7Cu solder and the composite solder reinforced with 1vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.
Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder. The effects of Ag particle addition on the microstructure of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound （IMC） layer of the Sn-0.7Cu solder and the composite solder reinforced with 1vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.
基金
supported by the New Star Project of Beijing Science and Technology Commission, China (No.2004B03)
