大规模集成电路封装用环氧树脂复合材料流动性影响分析

Flowability Analysis of the Epoxy Molding Composite used for the Packaging of Large-Scale Integrated Circuit

对不同环氧树脂的熔融黏度(150℃)进行了分析,结果表明,联苯型环氧树脂(TMBP)熔融黏度极低(0.02 Pa.s),用TMBP与邻甲酚醛环氧树脂(ECN)共混,可大大降低ECN的黏度。硅微粉含量和粒径对环氧树脂复合材料流动行为有较大的影响。随着硅微粉含量的增加,体系的熔融黏度大大增加。高硅微粉含量的体系,其熔融黏度在低剪切速率下,呈现"剪切变稀",在较高剪切速率下呈现"剪切变稠",而在高剪切速率下又表现为"剪切变稀";小粒径硅微粉填充体系在低剪切速率下黏度小,而在高剪切速率下黏度大,大粒径硅微粉填充体系正好与此相反。

The melting viscosities（ηa） of different kinds of epoxy resins was investigated.The results show that tetramethyl biphenyl epoxy resin（TMBP） has very low ηa（0.02 Pa·s at 150 ℃） and can be blended with ortho-cresol novolac epoxy resin（ECN） in order to decrease ηa of epoxy molding composite（EMC）.The effects of the content,particle size of silica on the flowability of EMC were researched systematically.The results show that ηa of system with higher content of silica changes complicatedly with increasing of shear rate（）,i.e.,ηa decreases with increasing of in the range of low,then increases with increasing of in the range of high,but decreases again with increasing of in the range of higher.The system filled by silica with small particle diameter has low ηa at low and high ηa at high ,but ηa of the system filled by silica with large particle diameter changes on the contrary.