炭黑填充EVA/PE-HD发泡材料的阻温特性

Resistance-temperature Behavior of CB-filled EVA/PE-HD Foamed Composites

采用开炼共混、模压发泡的方法制备了特导炭黑填充乙烯-乙酸乙烯酯(EVA)/高密度聚乙烯(PE-HD)发泡导电复合材料。考察了复合材料的渗滤阈值、泡孔结构和阻温特性,研究了EVA/PE-HD不同配比、发泡剂偶氮二甲酰胺(AC)和交联剂过氧化二异丙苯(DCP)含量等对复合材料电性能的影响。结果表明,当EVA与PE-HD的配比为80/20(质量比,下同),特导炭黑填充量为10%(质量分数,下同),AC含量为4%,交联剂DCP含量为0.5%时,EVA/PE-HD发泡导电复合材料具有比较理想的泡孔结构,经过升温电阻测试,该复合材料具有良好的开关特性,呈现明显的负温度系数效应(NTC)特性。

Blends of ethylene-vinyl acetate （EVA）/high-density polyethylene （PE HD） were filled with specially conductive carbon black （HG-1P） forming a conductive foamed composite via opencalendaring and mold foaming. The effect of the composition on the percolation threshold, pore structures, and resistance temperature behavior were investigated. When the mass proportion of EVA to PE-HD was 80 to 20, the content of specially conductive carbon black was 10 wt %, the content of AC was 4 wt %,and the cross-linker DCP was 0.5 wt %, the composite showed a fine pore structure and good switching characteristics, a clear negative temperature coefficient （NTC） was observed.