极限热环境下大功率PCB散热改进研究

HEAT DISSIPATION INVESTIGATION OF HIGH POWER PCB IN EXTREME THERMAL ENVIRONMENT

通过改进太阳罩结构、改变PCB安装形式、设置隔热等方式,对大功率PCB在大空间极限热环境下的散热方式进行了优化和数值模拟。研究结果表明,根据不同发热电子元件的功率及其在PCB上的安装位置及与PCB的连接形式,采用上述措施,可以显著改善散热效果。

Heat dissipation mode in an infinite space and extreme thermal environment is numerically studied and optimized for a PCB through improving the structure of a sun shield,modifying the layout of the PCB,and setting an insulation cavity.It is found that cooling effectiveness can be evidently improved via adopting the above-mentioned method according to the power and location of various heat generation elements in the PCB.