基于感应耦合等离子刻蚀技术的三维微拉伸梁制作工艺

Micromachining Processing of 3D Micro Tensile Specimens Based on Inductively Coupled Plasma Etching

根据感应耦合等离子(Inductively coupled plasma,ICP)刻蚀的机理,针对热氧化硅薄膜微拉伸梁的结构特点,研究ICP刻蚀制作3D微拉伸梁结构的工艺并解决其中的难点问题。介绍ICP刻蚀工艺参数对刻蚀质量的影响,包括存在的微负载效应和深宽比效应。详细介绍热氧化硅薄膜微拉伸梁的制作,其关键步骤是双掩膜两次ICP刻蚀形成阶梯状窗口结构,并在硅衬底表面形成释放了的热氧化硅薄膜梁。利用ICP刻蚀对单晶硅的高选择性,此制作工艺适用于各种薄膜的微拉伸梁制作。

Based on the mechanism of inductively coupled plasma （ICP） etching, the micromachining processing of 3D micro tensile beams is researched in the light of the structure characteristics of the thermal silicon dioxide micro-tensile beams and with the purpose of solving the main problems in the processing. The influences of ICP etching process parameters on etching quality, including micro loading effect and aspect ratio effect in existence, are presented. The micromachining processing of the beams is introduced in detail. The pivotal procedure is double-masks-twice-ICP etching to form stair-opening structures and to obtain the free-standing thermal silicon dioxide beams on the surface of silicon. Using the high selectivity of single crystal silicon in ICP etching, the processing method is applicable in the fabrication of micro tensile beams with various films.