通用功能型芯片置放载体在老炼试验与最终测试的应用

A Generalized Die Carrier for Stress and Final Tests

本文主要介绍了如何通过设计芯片置放载体,达成把单一功能的老炼(Burn-In,BI)与最终测试(Final Test,FT)板扩充成为通用功能型的试验板。由于产品的不同,芯片封装的形式及其接脚数目也不同。然而通过此称为"芯片置放载体"的设计大大提升了既有BI与FT测试板的使用,也使得BI与FT试验板将不再局限于本身所能提供的单一封装形式。这个芯片置放载体的设计中心思想是把原本需要不同封装形式的芯片,通过设计"信道转换板"(Channel Scramble Board,CSB)使得相同的芯片置放载体能适用于所有的芯片,如此即可达成把单一功能的BI与FT试验板扩充成为通用功能型。由实际的应用中可以证实这样的设计具有可执行性而且也可以扩大应用的领域。

In this paper,we introduce a solution to expand dedicated burn-in（BI） and final test（FT） boards to multi-purpose ones by a test carrier.Due to the differences on pin counts package types of various products,we introduce a ＂test carrier ＂ to enhance the applicability of the existing BI FT boards.By doing so,the uses of BI FT boards are not limited by the original package type.The key of our proposed approach is the use of a channel scramble board（CSB）,which realizes the possibility to use the same board for samples with various packages types and makes the original single-purpose boards（for both BI FT） to multi-purpose ones.From actual applications,we prove the feasibility of our design its applications can be further expanded.