摘要
在PCB上镀复形成电阻器的电阻性镍-磷(Ni-P)合金可以制造嵌入电阻器。这样沉积的Ni-P合金电阻器具有不良的电阻公差,要求采用旨在满足规格的昂贵的激光修整进行调节。如果无须激光调整即可降低公差,则可降低电阻器成本。本文中,变化影响图形精度、镀层和薄膜电阻率的一组参数,以评价它们对化学镀Ni-P电阻器的电阻公差的影响。还表征了基材对薄膜电阻率变化的影响。还讨论了无须激光调整可以获得低公差的Ni-P电阻器的设计指南。
Embedded resistors can be fabricated by plating resistive Nickel-Phosphorus（Ni-P）alloy to form resistors on printed circuit boards. As-deposited Ni-P alloy resistors typically have poor .resistance tolerances and require tuning by costly taser trimming to meet specifications. The cost of the resistors canbe reduced if the tolerances can be reduced without laser trimming. In this paper, a group of parameters offecting pattei＇ning accuracies, plating and sheet resistivities were varied to evaluate their effect of the substrate on sheet resistivity variations was also characterized. Design guidelines to obtain Ni-P resistors with low tolerance without laser trimming are also discussed.
出处
《印制电路信息》
2010年第1期32-36,共5页
Printed Circuit Information
