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氮化硅陶瓷套圈内圆磨削表面质量的实验 被引量:7

Experimental Research on Surface Quality of Si_3N_4 Ceramic Internal Grinding
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摘要 目的研究高速磨削试验下砂轮粒度、砂轮速度、磨削深度、工件速度等工艺参数对工程陶瓷材料磨削表面粗糙度的影响.方法利用MK2710型数控内外圆复合磨床对工程陶瓷内表面进行磨削加工,并利用Surtronic25接触式粗糙度测量仪进行表面粗糙度的测量,得到不同磨削工艺参数下的表面质量.结果单一因素试验分析得出表面粗糙度随着砂轮粒度的变小而降低,随着砂轮线速度增加而降低,随着工件转速的增大而减小,随着磨削深度的增大而增大;通过正交试验的分析得出,与工程陶瓷表面粗糙度关系最大的为砂轮粒度,其次为砂轮速度和磨削深度,工件速度影响最小.结论揭示了砂轮粒度、砂轮速度、磨削深度、工件速度对工程陶瓷表面粗糙度的不同影响,确定了最佳磨削工艺,并且进行试验验证,为工程陶瓷材料磨削加工提供了依据. This paper studies the influence of different wheel grain size, wheel speed, grinding depth, work- piece speed to engineering ceramics surface roughness based on high-speed grinding process experiment. This experiment was carried on using MK2710 NC grinding machine to grind engineering ceramics inner surface and using Surtronic 25 roughness instrument to measure the surface roughness. This method could get the surface qualities of different grinding process parameters. Through the analysis of single factor test, the surface roughness decreases with the grain size becoming smaller. With the increase of wheel speed and with the increase of workpiece speed, the surface roughness decreases. The surface roughness increases with the grinding depth increasing. Through orthogonal test's analysis, grain size is the most relevant factor that affect the surface roughness, wheel speed is the second effecting factor, grinding depth is the third influencing factors, workpiece speed has the least influence to the surface roughness. Conclusions are drawn that wheel grain size, wheel speed, grinding depth, workpiece speed have different influences to surface roughness, determined the best grinding process, made the experimental verification. This conclusion will provide the basis for grinding of engineering ceramics.
出处 《沈阳建筑大学学报(自然科学版)》 CAS 北大核心 2010年第1期176-179,共4页 Journal of Shenyang Jianzhu University:Natural Science
基金 国际科技合作项目(2008DFA70330) 辽宁省科技攻关计划项目(2007222009) 辽宁省教育厅创新团队项目(2009T081)
关键词 工程陶瓷 磨削工艺 表面粗糙度 正交试验 engineering ceramics grinding technology surface roughness orthogonal test
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参考文献11

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