联苯酐型聚酰亚胺胶粘剂的合成与性能

Preparation and Characterization of Polyimide Obtained from BPDA

以联苯二酐和三种含有醚键结构的二胺——4,4'-二氨基二苯醚(4,4'-ODA)、3,4'-二氨基二苯醚(3,4'-ODA)和1,3-二(4-氨基苯氧基)苯(1,3,4-APB)为原料,在N N-二甲基乙酰胺中通过逐步聚合反应,合成了三种含有柔性二胺结构的线性聚酰亚胺。分析了不同的溶剂及含水量对粘接性能的影响。考察了不同的分子结构对聚酰亚胺粘接性能和热性能的影响。通过红外分析,固化后的聚酰亚胺已经完全酰亚胺化;通过热失重分析发现,三种线性聚酰亚胺的热分解温度均在500℃以上,且由4,4'-ODA制得的聚酰亚胺(PI)耐热性能优于其余两种;热机械分析表明,1,3,4-APB具有最小的玻璃化转变温度。

Three kinds of linear polyimide containing flexible structure of diamine based on biphenyldianhydride, 4,4＇-oxidiamine （4,4＇-ODA）, 3,4＇-oxidiamine （3,4＇-ODA） and 1,3 -his （4-ami nophenoxy） benzene （1,3,4-APB） were synthesized in N N-dimethyl acetamide via transition polymerization. The chemical structures of them were characterized by Fourier transform infrared spectroscopic （FT-IR）. High thermal resistant properties were analyzed by thermal gravimetric analysis （TG） which Shows the temperatures of degradation of them are all above 500 ℃ and polyimide （PI） derived from 4,4＇-oxidiamine （4,4＇-ODA） possesses the highest decomposed temperature. Dynamic mechanical analysis indicates that PI derived from 1,3-bis （4-aminophenoxy） benzene （1,3,4-APB-PI） has the lowest glass transition temperature. Influences of different solvents and water content on lap shear strength and various chain structures on adhesion and high heat resistant properties were also investigated in this study.