固化剂对MG/PU/TDE-85灌封材料性能的影响

Effect of Curing Agent on Properties of MG/PU/TDE-85 Encapsulating Materials

以磨碎玻璃纤维(MG)为填料,分别采用甲基四氢邻苯二甲酸酐(MeTHPA)、甲基纳迪克酸酐(MNA)为固化剂,通过聚氨酯(PU)对4,5环氧环己烷1,2-二甲酸二缩水甘油酯(TDE-85)改性,研究了MG/PU/TDE-85/MeTHPA和MG/PU/TDE-85/MNA两种灌封材料的力学性能、热性能和电性能。研究结果表明,两种灌封材料都具有很高的力学性能、热性能和电性能。与MG/PU/TDE-85/MNA灌封材料相比,MG/PUTDE-85/MeTHPA灌封材料的拉伸强度、半寿温度、体积电阻较高,而冲击强度、玻璃化转变温度略低。

With methyl tetrahydrophthalie anhydride （MeTHPA） or methyl nadic anhydride （MNA） cured respectively and polyurethane modification of diglycidyl-4, 5-epoxycyclohexane-1,2-dicarboxylate （TDE-85）, two encapsulating materials of MG/PU/TDE-85/MeTHPA and MG/PU/TDE-85/MNA were prepared by the reinforcement of milled glass fiber （MG）. The mechanical properties, thermal properties and electrical properties of two encapsulating materials were studied. The results indicate that two encapsulating materials both have good mechanical properties, thermal properties and electrical properties. The tensile strength, half decomposition temperature and volume resistance of MG/PU/TDE-85AMeTHPA encapsulating material are higher than MG/PU/ TDE-85/MNA encapsulating material, but its impact strength, glass transition temperature are lower.