摘要
选取了三类耗材选型方案来进行工艺试验研究,主要包括焊膏、清洗剂、助焊剂,并且依托于典型的印制板以及元器件来完成试验件。基于方案中的耗材基础性能测试、印制板组件试验件焊点机械强度测试以及焊点微组织结构分析来完善耗材选型,优化匹配性设计,确定最终耗材型号,进一步提高焊点质量和可靠性。
Three kinds of accessorial materials, including solder,cleanout liquid and soldering-aided liquid are selected to complete technical test through research analyue,and test products ere accomplished based on typical PCB and components. In this paper we perfect aocessorial material choosing, optimize matching design and confirm final type through the basel performance test of accessedat material . the mechanical intensity test of soldering point and the structural analyze of soldering point to PCBA, ulteriody enhance the quality and dependability of soldering point.
出处
《电子质量》
2010年第1期24-26,40,共4页
Electronics Quality
关键词
印制板组件
耗材
焊点
PCBA： accessorial material
soldering point
