摘要
在Sn-Zn系无铅焊料的基础上,通过添加合金元素Al和P制备出不同成分的无铅焊料,研究了其无铅焊料的物理性能。结果表明:通过加入适量合金元素Al和P的Sn-Zn-Al-P系无铅焊料在基本上不影焊料响熔点的前提下,可以减小密度,降低成本,提高其导电性能和润湿性。
The different weight percentages of Sn-Zn-Al-P lead-free solders were processed by adding alloying elements AI and P. The physical properties of Sn-Zn-Al-P lead-free solders were researched. The results show that appropriate amount of alloying elements Al and P of Sn-Zn-Al-P lead-free solders can reduce the density to cut the costs and improve conductive property and wetting ability without the effect of melting point of Sn-Zn-Al-P lead-free solders.
出处
《热加工工艺》
CSCD
北大核心
2010年第1期24-26,32,共4页
Hot Working Technology
基金
上海市重点学科建设项目资助(B503)
关键词
无铅焊料
熔点
导电性能
润湿性
lead-free solder
melting point
conductive property
wetting ability
