摘要
以Sn0.7Cu共晶钎料作为基体钎料,通过添加微细金属颗粒(1μmAg、1μmNi和8μmCu)形成颗粒增强复合钎料。研究了增强颗粒对复合钎料铺展性能的影响,优选出Sn0.7Cu基复合钎料的最佳增强体。研究表明:Ni(3vol%)颗粒增强Sn0.7Cu复合钎料铺展性能差;Cu(3vol%)颗粒增强复合钎料铺展性能不如Ag(3vol%)颗粒增强复合钎料;对于金属颗粒增强Sn0.7Cu基复合钎料,Ag颗粒为最佳增强体。
The particle-reinforced composite solders were prepared by adding 1μm Ag, 1 μm Ni and 8μm Cu to Sn0.7Cu eute ctic solder in current research. The appropriate reinforcement particles were selected and the effects of reinforcement particles on physical properties, mechanical properties and solderability of the composite solder were studied. The spreading property of Ni （3 vol% ）particle-reinforced Sn0.7Cu based composite solder was the worst among Sn0.7Cu based composite solders. The spreading property of the Cu particle-enhanced Sn0.7Cu based composite solder was worse than those of Ag particle-enhanced Sn0.7Cu based composite solders. So Ag particles were considered as the most appropriate reinforced particles for Sn0.7Cu based composite solders.
出处
《热加工工艺》
CSCD
北大核心
2010年第1期29-32,共4页
Hot Working Technology
基金
江苏省高校自然科学研究基金资助项目(09KJD430012)
