期刊文献+

全自动引线键合机送丝系统受力模型及实验 被引量:3

Stress Model and Experiment on Wire Feed System of Automatic Wire Bonder
下载PDF
导出
摘要 丝线传输的阻力控制和张紧力控制是引线键合机送丝系统的关键技术之一,对键合质量有着重要的影响.为了解决当前全自动引线键合机送丝系统中的传输阻力大、传输张力不稳定等问题,根据引线键合工艺过程和系统的技术要求,设计了由气体导轨和真空张紧装置组成的低摩擦送丝系统,来实现金丝的低阻传输.建立了金线在气体导轨和真空张紧装置内的受力模型,得出了二者的控制参数与金线作用力的关系;分别对金丝在气体导轨和真空张紧装置内的受力模型进行了实验验证,实验结果表明达到了所要求的低摩擦力要求. Resistance control of wire transmission and force control of tension are the key technologies of the wire feed system and have a critical impact on the bonding quality. To solve the problems of large transmission resistance and unstable transmission tensile force of wire feed system in automatic wire bonder, low-friction wire feed system composed of air guide and vacuum tension device based on the wire bonding process and technological requirements of the system was designed to reduce the resistance of wire transmission. The stress models of gold wire in the air guide and vacuum tension device were established and the relationship between the control parameters and force on the wire of the two parts were found. Experiments were carried out to verify the stress models of gold wire in the air guide and air tensioner, the results of which show that the models meet the low friction requirement.
出处 《纳米技术与精密工程》 EI CAS CSCD 2010年第1期31-36,共6页 Nanotechnology and Precision Engineering
基金 国家自然科学基金资助项目(50705027) 国家高技术研究发展计划(863)资助项目(2007AA04Z343)
关键词 引线键合 送丝系统 气体导轨 真空张紧 wire bonding wire feed system air guide vacuum tension
  • 相关文献

参考文献13

  • 1Ignazio J D. Wirebonding reign continues [ J]. Semiconductor International, 1996, 6 : 117-126.
  • 2Liu Yanjie, Liu Yuetao, Sun Lining. Automatic wire bonder designed for MEMS packaging[ C] //Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Nice, Japan, 2008:21-23.
  • 3Hu C M, Guo N Q, Du H J, et al. Vibration characteristics of the capillary in ultrasonic wire bonders [ J ]. Proceedings of the Institution of Mechanical Engineers ( Part C) : Journal of Mechanical Engineer Science, 2007, 221 ( 8 ) : 897-903.
  • 4Okikawa J I. Gold wire enhanced thermocompression, thermosonic wire bonding [ J ]. Journal of Electronic Engineering, 1995(7) :22-30.
  • 5SEMICON. World semiconductor equipment market [J]. Solid State Technology, 2000, 43(10) :22-25.
  • 6Tamm S W, Cheung N C. A high speed, high precision linear drive system for manufacturing automation [ C ]// Applied Power Electronics Conference and Exposition. Anaheim, USA, 2001:440-444.
  • 7Chylak B, Kumar S. Optimizing the wire bonding process for 35 μm ultra-fine-pitch packages [ C ]//SEMICON Singapore 2001. Singapore, 2001:321-325.
  • 8Hong S J, Cho J S. The behavior of FAB and HAZ in fine gold wire [ C ]//Electronic Materials and Packaging. Jeju Island, Korea, 2001:53-55.
  • 9易容.金丝键合质量信息研究[M].南京:南京理工大学出版社,2004.
  • 10马鑫 何小琦.集成电路内引线键合工艺材料失效机制及可靠性.电子工业专用设备,2004,10:12-17.

共引文献6

同被引文献6

引证文献3

二级引证文献6

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部