丁羟聚氨酯电器灌封胶的研制

Preparation of Polyurethane encapsuant for Electronic components bsaed on Hydroxyl-Terminated Polybutadiene(HTPB)

以端羟基液体聚丁二烯（简称丁羟）为主要原料制备丁羟聚氨酯电器灌封胶，考察了增塑剂、填料、扩键剂、催化剂以及温度等因素对其性能的影响。

Polyurethane encapsulant for electronic components were prepareted by Hydroxyl-Terminated Polybutadiene(HTPB) The effcts of plasticizers,fillers,chain extenders,catalyst and temperature on the properties were invewtigated.