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液相连接氮化硅陶瓷的结合强度研究 被引量:1

Bond Strength of Joined Silicon Nitride Ceramics by Liquid Phase Bonding Method
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摘要 本文用玻璃焊料研究了氮化硅陶瓷的液相连接,探讨了组份(0~10wt%α-Si3N4)、温度(1450~1650℃)和保温时间(10~120min)对结合强度的影响规律.结果表明,α-Si3N4的加入提高了液态焊料的粘度,降低了焊料的流动性,导致结合强度下降.采用组份为不含α-Si3N4的纯氧化物玻璃焊料在1600℃、保温30min可以得到较为理想的结合强度. The liquid phase bonding of silicon nitride ceramics by using glass adhesives was studied.The effects of adhesive composition and joining conditions such as temperature (1450-1650℃)and holding time (10-120min) on the bond strength of the joint were investigated. The resultsshowed that increasing viscosity of the adhesive by the addition of αSi3N4 powder to the glass,and consequently reducing fluidity of the adhesive degraded the bond strength. The optimumbond strength was obtained when joined at 1600℃ for 30min by using pure oxide glass adhesivewithout α-Si3N4 powder.
出处 《无机材料学报》 SCIE EI CAS CSCD 北大核心 1998年第5期763-768,共6页 Journal of Inorganic Materials
基金 上海市自然科学基金!97ZE14037
关键词 氮化硅 连接 结合强度 陶瓷 液相连接 silicon nitride, bonding, bond strength
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