摘要
文章概述了树脂塞孔后直接进行压合的工艺流程和主要工艺参数,通过实验对树脂塞孔范围进行评估与界定。通过研究开发树脂塞孔工艺,拓展了公司的产品范围和结构,提升了工艺制造水平。
This paper summarizes the post-resin plug holes directly Pressing the process and the main process parameters, through the experiment to define the scope of resin plug holes （only a first-order laser-blind buried holes）. Resin plug holes through research and development process, expanding the company＇s product range and structure of the enhanced technology and manufacturing standards.
出处
《印制电路信息》
2010年第2期31-34,52,共5页
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