键合线弧高度对键合拉力的影响分析

The Analysis of Influence on Different Loop Height of Wire Bond

在集成电路封装的质量控制中,键合拉力的地位非常重要。作为键合质量好坏的主要判定基准之一,影响键合拉力的因素有很多,包括键合工艺参数、焊线材料类型、拉力测试吊钩的测试位置、焊线线径以及线弧的长度和高度等。主要讨论在键合线弧投影长度不变的情况下,线弧高度的变化对键合拉力产生的影响。通过对不同线弧高度条件下测得的拉力数据进行整理分析,结果表明:键合线弧越高,拉力就越大;反之,拉力则越小。这为集成电路组装的正常量产过程中,工程技术人员对于键合线弧整体高度的合理有效控制及键合拉力规范的合理定义提供了参考依据。

Wire pull test play an important role in the quality control of IC assembly. As one of the main assess- able data for wire bond quality. There are many factors affecting the wire pull, including wire bond process parameters,wire material type,the test position of wire pull test hook,wire diameter along with loop length and loop height, etc. This paper mainly discussed the influence of wire pull based on the wire bond loop height changed with the loop projection length not changed. By analyzing the wire pull data of different loop heights, The result indicated： wire pull is more stronger as loop height is more heighter,otherwise wire pull is poorer.It laied the foundation of loop holistic height control and the wire pull spec in mass production of IC assembly to engineers and technicians.