摘要
三维多芯片组件(3D MCM-Three Dimension Multi-Chip Module)是近几年正在发展的一种电子封装技术。在3DMCM封装中,随着芯片封装密度的增加,对其热分析与热设计技术就显得越来越重要了。文章利用有限元方法,通过Ansys软件工具对某静态存储器组件(3DMCM模块)内部温度场进行了模拟仿真,并与实验数据进行了对比,获得了很好的分析效果,为3DMCM的可靠性设计提供了技术支持。
The packaging technology of three-dimension multi-chip module is an important developing direction in micro-electronic packaging technology in the future. With the developing of die package density increasing, the heat analysis and heat controlling technology for 3D MCM package becomes more and more important. In this article, thermal field of one SRAM component （stacked packaging） is analyzed using Ansys software by finite element method, and compared with the result by testing, Providing a way for reliability design or 3D MCM.
出处
《电子与封装》
2010年第1期4-7,共4页
Electronics & Packaging
