半导体制造过程的多工序协同控制模型

Multi-process cooperative control model for semiconductor manufacturing processes

针对半导体制造过程的多工序质量控制,提出一种协同控制模型.该模型由目标优化、设备选择和设备控制3层组成.目标优化层利用目标优化模型对下游关键工序参数的目标值进行优化,补偿上游工序偏差对产品质量特征的影响;设备选择层综合考虑设备性能、生产时间以及设备的可利用性,选择处于最佳状态的设备完成相应的工序操作;设备控制层对选定的设备进行Run-to-Run控制,降低产品批次间的差异.从某半导体制造车间采集多道关键工序的测试数据,建立协同控制模型.通过基于生产数据的仿真,证实协同控制模型能够改善产品质量,提高设备效能和生产效率.

A multi-process cooperative control model is proposed to deal with the problem of quality control for semiconductor manufacturing processes. The model consists of three tiers：target optimiza- tion, tool selection and tool control. In the target optimization tie, the target values of downstream key process parameters are optimized to compensate the effect of the deviation of upstream processes on product quality characteristics. In the tool selection tie, a best tool is selected based on tool perform- ance, throughput time and tool availability to implement the corresponding process operation. In the tool control tie, Run-to-Run control is used to decrease difference between batches of products. Large test data sets are collected from multiple key processes in a semiconductor manufacturing shop and are processed to build the cooperative control model. Simulations were carried out based on the real data. It is demonstrated that the proposed model can be applied to improve the product quality and increase the equipment effectiveness and productivity.