Sn-Ag-Cu无铅焊锡粉末雾化工艺参数的优化

Study on optimal atomizing processing parameters of Sn-Ag-Cu lead-free solder powder

利用自行设计的超音速雾化制粉装置,通过正交实验法对Sn3Ag2.8Cu无铅焊锡粉末的雾化工艺参数进行优化,研究合金过热度和导液管内径对Sn3Ag2.8Cu无铅焊锡粉末有效雾化率、平均粒径、粒度分布及氧含量的影响。结果表明:过热度对无铅焊锡雾化粉末的平均粒径和氧含量影响更大;导液管内径对无铅焊锡雾化粉末有效雾化率和离散度影响更大。当过热度为250℃,导液管内径为3mm,雾化粉末具有更好的综合性能。在与Cu基板的钎焊中,和Sn37Pb粉末相比,利用Sn3Ag2.8Cu粉末配制的焊锡膏与铜基板之间形成的IMC层更厚,且更不规则。

The experiment studied the effects of inner diameter of the delivery tube and the superheat condition for alloy on the properties such as efficient atomization efficiency, average diameter, size distribution and oxygen content of Sn3Ag2.8Cu lead- free solder powder with the supersonic atomizer designed by ourselves, and optimized atomizing processing parameters of the lead-free solder powder by orthogonal experimental design. The results show that the superheat condition for alloy has more effects on the average diameter and oxygen content of the powders, the inner diameter of the delivery tube has more effects on the efficient atomization efficiency and size distribution of the powders. When the superheating temperature for alloy is 250 ℃, and the inner diameter of delivery tube is 3 mm, the atomized powder possesses optimal combination property. When the Sn3Ag2.SCu powder is brazed with the copper plate, the IMC layers is thicker and more irregular, compared with Sn37Pb powder.