摘要
研究了Sn-(1.3~1.5)Bi-(0.4~0.6)sb无铅焊料的制备工艺和微观组织,并测试了钎料的相关物理、力学性能,阐述了焊料的力学性能与微观结构特征间的关系。试验测试结果表明:该焊料具有较高的强度和塑性,具有良好的润湿铺展性和机械加工性能。焊料微观结构由(Sn)、B(SbSn)第二相和(Bi)所构成,其抗拉强度为55.4MPa,延伸率为35.9%,扩展率为80.6%,熔点为226.9℃~234.4℃。
The research explores the manufacturing process, microstructures, mechanical and physical properties of Sn - ( 1.3 - 1.5 ) Bi - (0.4 - 0.6 ) Sb solder, and analyses the relation between mechanical properties and microstructures of the solder. The results shows that the solder has high strength and ductibility, good wettability and manufacturing property. Its microstructure consists of(Sn), β (SbSn)and (Bi). And the solder has the tensile strength of 55.4 Mpa, the elongation of 35.9% , the spread rate of 80.6% ,and the melting point of 226.9℃~234.4℃.
出处
《电子工艺技术》
2010年第1期16-19,共4页
Electronics Process Technology
基金
浙江省科技计划项目(项目编号:2006F20003)
关键词
无铅焊料
制备工艺
微观组织
力学性能
Lead - free solder
Process
Microstructure
Mechanical properties