航天产品电子装联过程中CCD落焊工艺

Techniques of CCD Soldering in Electronices Assembly of Aerospace Products

由于CCD为Ⅰ级静电敏感器件且是航天产品电子系统的重要部件,其装配性能的好坏直接影响航天产品整机可靠性,因此CCD器件落焊多数情况下被定为关键工序。主要分析了CCD器件在光电设备中的应用特点及重要性,论述了CCD落焊过程中在环境控制、人员和设备配备等方面应具备的必要条件,重点描述了CCD落焊的工艺流程,提出了大面阵和大尺寸CCD插座分段解焊的工艺方法以及落焊过程涉及的相关工艺技术条件,为开展CCD落焊工作提供一定的参考。

CCD is I grade static - sensitive device and important component of electronic system of aerospace products, the performancy of assembly affects the reliability of aerospace products, so the process of CCD soldering is identified as key processes in most cases. Analyzed the application characteristics and the importants of CCD device in optoelectronic instrument. The necessary conditions were discussed on CCD soldering process in the environmental control, personnel and equipment. Described technique process of the CCD soldering , the method of technique and its related techniques conditions of large - array, large - size CCD devices.