用于微结构成型的新型热压机温度控制系统研究

Research on Temperature Control System of Hot-Embossing Equipment for Polymer Micro-Structure

针对利用热压方法制备可降解高分子材料微器件方面存在的温度控制问题,研究适用于热压成型机的温度控制系统。基于在可降解聚合物PLGA等材料的微结构制作过程中,温度对微结构成型质量影响的规律,设计热压成型样机中的温度控制系统。通过对可降解聚合物的低温热压成型实验,证实了所研究的温度控制系统能够实现热压温度的自动控制,并满足可降解高分子材料微结构成型的工艺要求。

For the needs of a new type of biodegradable implantable drug delivery control system of the hot-embossing equipment are designed and manufactured.A new temperature control system is presented to improve the fabrication quality of the biodegradable polymer micro-structures in hot embossing.The results indicate that the control system can successfully control the embossing temperature automatically and meet the hot embossing process requirements.