摘要
本文建立了多工位公自转磁控溅射系统镀膜过程的物理模型,通过把基片运动与镀膜过程的模拟结合在一起,运用时间步长划分的算法仿真公自转系统下矩形靶沉积的三维膜厚分布,并使用同样的方法计算纯自转磁控溅射系统沉积薄膜的厚度分布,最后将两个结果进行对比。研究表明,随着自转与公转速度比例的调节,公自转系统在最优转速比0.5时所制得的薄膜厚度均匀性较纯自转系统得到明显地改善,此结论与实验结果保持一致。
The thickness uniformity of thin film deposited by magnetron sputtering system with rotation and revolution was studied. The model of sputtering process is presented for this system. By combining substrate motion and coating process and using the model of partition of time step, three-dimension distribution images of the film thickness for this system with rectangle target are calculated, which are compared with the simulation results of the film thickness for non-revolution magnetron sputtering system. Research indicates that the thickness uniformity of the film is improved when the ratio of the rotation speed to the revolution speed is 0.5, and the conclusion is in good agreement with experimental results.
出处
《仪器仪表学报》
EI
CAS
CSCD
北大核心
2010年第1期218-222,共5页
Chinese Journal of Scientific Instrument
基金
自然科学基金(60806021)
国家863计划(2007AA03Z424)
新世纪优秀人才计划(NCET-06-0812)资助项目
关键词
磁控溅射
转速比
膜厚均匀性
magnetron sputtering
the ratio of rotation speed to revolution speed
thickness uniformity of thin film
