摘要
本文以TI公司的DSP5509A为例,介绍了在ATE上开发DSP芯片的测试程序的思路和方法。本文论述的DSP功能模块的测试算法,指令测试方法,脱机开发DSP功能诊断程序的方法已经在国产BC3193V50集成电路测试系统上运用,结果表明是有效的。其中针对DSP功能模块的测试算法以穷举为出发点,具体实现方式包括基本测试模块的反复调用,同模块内所有属性的遍历测试,不同模块间属性的交叉组合测试。最后本文论述了测试程序在不同测试系统移植中需要注意的问题。
This paper introduced the method of testing DSP chip on ATE by using TI company 's DSP5509A chip for instance. The paper discussed the DSP' s functional module testing algorithm, the method for DSP' s instructions testing and the method of writing the DSP function' s diagnosis sequence independent from ATE. The algorithm and the methods mentioned above have been applied on the BC3192V50 integrated testing system. The result shows the algorithm and the methods are effective. Specially, the DSP' s functional module testing algorithm originates from the base of covering all the functional modules' attributes. The ways of realizing the functional module testing algorithm include transferring the basic test module, testing all the attributes within identical module and testing the extend attributes across different modules. Finally, the paper discussed the test program' s transplantation between different ATES.
出处
《电子测试》
2010年第2期63-68,共6页
Electronic Test