摘要
研究了ＳｉＯ２化学机械抛光（ＣＭＰ）浆料制备过程中水溶液ｐＨ值、分散时间、搅拌转速、母液浓度、分散工艺等因素对制备及浆料性能的影响，讨论了母液法、直接法分散机理。
It was studied that the aqueous solution's pH, the disperse time, the agitation rate, the raw slurry's concentration, the disperse process, et al. affect the preparation of silica slurry for chemical mechanical polishing and the properties of the obtained slurry. The mechanics of the direct method and the indirect method process were discussed.
出处
《华东理工大学学报（自然科学版）》
CAS
CSCD
北大核心
1998年第6期681-685,共5页
Journal of East China University of Science and Technology
基金
国家自然科学基金
关键词
化学机械抛光
分散
二氧化硅
胶体
浆料
制备
chemical mechanical polishing
dispersion
silica
colloid
rheology
