铜合金渗硅层耐磨性及工艺控制

Wearablity of Siliconized Copper based Alloy and Process Crotrolling

对铜合金进行固体渗硅的工艺方法和渗硅后铜合金表面行为进行了研究。采用本院研制的渗剂对ＺＱＳｎ６－６－３进行渗硅化学热处理，获得了０．８～１．２ｍｍ的渗层。探讨了热处理温度、保温时间等工艺参数对渗层厚度和渗层性能的影响；研究了铜合金渗硅层的微观结构，结合粘着理论、磨损剥层理论和晶体结构，揭示了渗硅后提高耐磨性的原理。研究表明，渗硅的控制步骤是硅在铜合金中的扩散，并给出了渗层厚度与温度及保温时间的经验公式。

The process of solid powder siliconizing of copper based alloy and the surface character and behavior of the alloy after siliconizing treatment are studied in this paper. A siliconized layer with 0.8￣1.2mm thickness was made by using the powder compounded by ourselves. Effects of the process parameters on the thickness and the character of the layer, such as, temperatures, the holding time, and effects of the microstructures of the siliconized layer are studied. The research results indicat that the diffusing of the silicon in the alloy is the RDS of the process, uncovered the relationship between the microstructures and the wearablity. An experimental equation calculating the thickness of the layer is proposed.