改进制备钯/陶瓷复合膜化学镀新工艺

Improved Electroless Plating for Preparation of Pd/Ceramic Composite Membrane

对利用渗透作用的化学镀新工艺进行了全面的改进，对陶瓷管所处环境、镀液浓度、沉积温度和镀膜时间以及对钯层沉积量和表面形貌的影响进行了系统的研究。结果表明，镀液浓度、沉积温度和镀膜时间对钯层沉积量和表面形貌具有较为明显的影响，而陶瓷管所处环境只影响钯层沉积量。改进后的工艺比其他类型的化学镀具有较高的钯沉积速率，较短的制膜时间和较高的镀液利用率，使制膜成本降低。

The electroless plating with osmosis was improved by using hydrazine as reducer, so the plated Pd film is pure and not alloyed. Effects of the new technology(such as the bath in which the ceramic tube was immersed, the concentration of electroless plating bath, the deposition temperature, the time of improved electroless plating) for Pd/ceramic composite membrane on the amount and SEM micrographs of plated Pd film were studied. It was observed that the concentration of electroless plating bath, the deposition temperature and the time of improved electroless plating had great effect on the amount and SEM micrographs of plated Pd film, however the bath in which the ceramic tube was immersed had great effect on the amount of plated Pd film and little effect on SEM micrographs of plated Pd film. The rate of plating Pd was higher than that of other types of electroless plating, thus the new technology increased the utilization of plating bath and reduced the cost of preparation of membranes and the deposition time. The plated Pd film by this improved electroless plating combined with the ceramic tube tightly.