摘要
阐述了影响电子部件可靠性的环境因素及作用机理,从使用材料和工艺方面进行了分析比较。选择合适的材料,采用合理的工艺方法,是提高电子部件可靠性的有效技术途径。
The environmental factors and action mechanism to influence the electronic components reliability were analyzed in this paper.Both the used materials and the processes were analyzed and compared.Selecting suitable materials and adopting reasonable processes are effective technological approaches to increase the electronic components reliability.
出处
《粘接》
CAS
2010年第2期74-77,共4页
Adhesion
关键词
环境因素
可靠性
工艺方法
空空导弹
environmental factor
reliability
process methods
air-to-air missile
