Sn-Zn系无铅钎料研究中的几个热点问题

Several hotspots in research of Sn-Zn lead-free solders

介绍了Sn-Zn系无铅钎料的应用及研究现状,阐述了Sn-Zn系无铅钎料研究中的几个热点课题。对Sn-Zn系无铅钎料的熔化行为、组织及力学性能相关的研究进行了总结。针对Sn-Zn钎料润湿性、高温抗氧化性、耐腐蚀性这几个不足,对目前的研究情况进行了分析、探讨;另外,还介绍了Sn-Zn系钎料与基板的界面反应和焊点可靠性的相关研究现状。

The application and research status of Sn-Zn based lead-free solders is reviewed; several hotspots in the research of Sn-Zn based lead-free solders are also expounded.The melting behavior,microstructures,and mechanical properties of the Sn-Zn solders were also summarized. Researches on the disadvantages of Sn-Zn solders such as wettability,antioxidation,and corrosion resistance are analyzed and discussed. Furthermore,the interface reactions between Sn-Zn solders and substrates as well as the reliability of the soldered joints are also introduced.