摘要
介绍了一种P型超浅结的制作工艺。该工艺通过F离子注入和快速热退火技术相结合,获得了比较先进的100nm以内的P型超浅结;重点研究了影响超浅结形成的沟道效应和瞬态增强扩散效应;详细介绍了制作过程中对沟道效应和瞬态增强扩散效应的抑制。
Fabrication of P-type ultra-shallow junction was presented. By using F ion implantation and rapid thermal annealing (RTA), a P-type ultra-shallow junction below 100 nm was obtained. Channeling effect and transient enhanced diffusion (TED) effect, which affect the formation of ultra-shallow junction, were studied in particular. Furthermore, the inhibition of the two effects, which was very important in the process,was also discussed.
出处
《微电子学》
CAS
CSCD
北大核心
2010年第1期145-148,共4页
Microelectronics
关键词
超浅结
离子注入
快速热退火
沟道效应
瞬态增强扩散效应
Ultra-shallow junction
Ion implantation
Rapid thermal annealing
Channeling effect
Transient enhancement diffusion effect