热功率信号下芯片温度动态响应及热特性分析

Analysis on Temperature Dynamic Response and Thermal Characteristics of Chips Based on Thermal Power Signals

针对电子元件在瞬态传热中的热惯性问题,对芯片在热功率信号作用下的温度动态响应特性进行识别。根据芯片温度对芯片发热功率的阶跃响应曲线,求得芯片上关键点的传递函数;根据芯片温度的方波响应曲线和正弦响应曲线,重点对热功率信号给芯片造成的温度冲击与信号周期之间的关系进行分析。该研究对提高电子元件抵抗热冲击和热疲劳的能力具有指导意义。

In order to explore thermal inertia of electronic components, dynamic temperature response characteristics of chips based on thermal power signals were identified. According to step function response curves of chip＇s temperature, transfer functions of temperature at chip＇s key points were established. Relationship between temperature shock to chips induced by thermal power signals and signal period was analyzed in detail, based on square wave signal and sine signal response curves of chip＇s temperature. This work is helpful in improving the capability of electronic components to resist thermal shock and thermal fatigue.