半刚性路面层间实际结合状态的有限元模拟与分析

Finite Element Simulation and Analysis of Practical Inter-layer Bonding State of Semi-rigid Pavement

为了分析半刚性路面在层间实际结合状态下的应力及弯沉分布情况,同时为常规路面设计提供必要的校核手段,根据相关试验结果,利用通用有限元软件的接触模型来模拟路面的层间实际结合状态,并且考虑高温、超载等不利因素的影响,分析路面在层间实际结合状态、不利因素影响下的应力及弯沉变化情况。结果表明,利用有限元软件的接触模型对路面层间实际结合状态进行模拟是可行的,摩擦系数有条件时应根据实际试验结果确定,无条件时,可在0.6～0.8之间选取。

In order to analyze stress and deflection distribution in semi-rigid pavement in practical inter-layer bonding state, and meanwhile provide necessary examination means for conventional pavement design, this paper simulates the practical inter-layer bonding state of pavement by means of the contact model of general finite element software in accordance with the related test results, and analyzes stress and deflection changes of pavement in practical inter-layer bonding state and under influence of adverse factors into consideration such as high temperature and overloading, etc. The analysis results show that the simulation for practical inter-layer bonding state of pavement by means of the contact model of the finite element software is feasible, and the friction coefficient if possible can be determined based on the actual test results, otherwise, can be selected between 0.6-0.8.