摘要
对SnAgCu焊锡材料在应变率0.001、600、1200、1800s-1下的拉伸和压缩力学性能进行了测试,得到了不同应变率下的应力应变曲线。结果表明,该材料不仅具有明显的应变率效应,而且其动、静态的塑性硬化模量差异很大。金相分析显示:准静态压缩时,塑性变形主要由晶粒的转动、变形和晶界的滑移控制;而动态压缩时,可观察到材料内部的枝状晶粒被折断为大量次级晶枝,呈现出明显不同于准静态情况下的变形机制。
The split Hopkinson bar technique and the material test system were applied to explore experimentally the mechanical properties of SnAgCu solder at room temperature.The stress-strain curves obtained at different strain rates indicate that SnAgCu solder exhibits a strong strain-rate effect and its plastic hardening moduli have great difference under quasi-static and impact loads.Metallographic analysis shows that the plastic deformation in SnAgCu solder under quasi-static compression is governed by the rotation and deformation of crystal grains,and the dendrite deformation has directivity.While under dynamic compression,the deformation mechanism is distinctly different from that under quasi-static compression,the dendrite as the original phase is no directivity and the primary dendrite arms are broken into secondary dendrite.
出处
《爆炸与冲击》
EI
CAS
CSCD
北大核心
2009年第5期542-545,共4页
Explosion and Shock Waves
