电化学制备Ni-Cu/Cu超晶格多层膜

SINGLE BATH ELECTRODEPOSITION OF Ni Cu/Cu SUPERLATTICE MULTILAYERS BY DUAL POTENTIAL PULSE TECHNIQUE

采用单槽双脉冲恒电位制备了超晶格Ｎｉ－Ｃｕ／Ｃｕ多层膜，测试结果表明：Ｎｉ－Ｃｕ层与Ｃｕ层间界面清晰，各层均匀连续、相互覆盖，具有良好的周期结构；Ｎｉ－Ｃｕ４．６ｎｍ／Ｃｕ１．４ｎｍ是具有良好外延生长的超晶格结构，铜、镍生长的择优取向面为［１１１］晶面，该材料表现出特殊的阳极溶解性能．

The preparation of Ni Cu/Cu superlattice multilayers have been achieved in single bath by dual potential pulse technique. Results showed that there is a clear interface between Ni Cu and Cu layers, and every sublayer is homogeneous and continuous with good periodicity in this multilayers. The Ni Cu 4.6nm /Cu 1.4nm exhibits superlattice structure with epitaxial growth and has very different anodic behavior, specially showing strong corrision resistent properties.