摘要
采用单槽双脉冲恒电位制备了超晶格Ni-Cu/Cu多层膜,测试结果表明:Ni-Cu层与Cu层间界面清晰,各层均匀连续、相互覆盖,具有良好的周期结构;Ni-Cu4.6nm/Cu1.4nm是具有良好外延生长的超晶格结构,铜、镍生长的择优取向面为[111]晶面,该材料表现出特殊的阳极溶解性能.
The preparation of Ni Cu/Cu superlattice multilayers have been achieved in single bath by dual potential pulse technique. Results showed that there is a clear interface between Ni Cu and Cu layers, and every sublayer is homogeneous and continuous with good periodicity in this multilayers. The Ni Cu 4.6nm /Cu 1.4nm exhibits superlattice structure with epitaxial growth and has very different anodic behavior, specially showing strong corrision resistent properties.
出处
《武汉大学学报(自然科学版)》
CSCD
1998年第6期700-702,共3页
Journal of Wuhan University(Natural Science Edition)
基金
国家自然科学基金