界面反应层厚度对Ti/ZrO_2钎焊接头强度的影响

THE EFFECT OF THICKNESS OF INTERFACIAL REACTION LAYER ON Ti ZrO 2 JOINT STRENGTH

通过活性钎料Ａｇ６６Ｃｕ３０Ｔｉ４对ＺｒＯ２的浸润试验测定了钎料／陶瓷界面反应产物、浸润角和反应层厚度与温度的关系。将Ｔｉ和ＺｒＯ２在不同温度下进行钎焊连接，得出了接头强度和钎焊温度（即反应层厚度）的关系：存在一最佳厚度，此时可获得较高的连接强度。

The wetting test of active solder Ag 66 Cu 30 Ti 4 to ZrO 2 was studied in this paper.The interfacial product of solder ceramic was defined and the dependence of wetting angle and reaction layer thickness on temperature was obtained.Ti and ZrO 2 were bonded by traze at different temperature and the relationship of joint strength with temperature (i.e. reaction layer thickness) was found.There was a optimum thickness,when the higher joining strength was reached.