期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

BGA焊接可靠性分析及工艺改进 被引量：3

Reliability Analysis and Technology Improvement of BGA Welding
下载PDF
导出
摘要 结合实际工作中的体会和经验,就BGA焊点接收标准、缺陷表现及可靠性等问题展开论述,特别对焊接中出现空洞的原因和空洞形成机理进行分析和归纳,并提出一些改善BGA焊点质量的建议。结果表明,其归纳科学、正确,对研究和从事电子产品焊接技术具有较好的参考作用。 Combine the working experience, discuss the BGA welding point qualified standards, bug representation and reliability. Especially analyze and induce the reason and creation of welding inanition. Then, give some suggestions for improving the BGA welding point. The result shows that it is reasonable and right, which will give the reference for researching and working the electronic product welding technology.
作者 赵国玉 廖华冲 朱文兵
机构地区 中国兵器工业第五八研究所产品制造部
出处 《兵工自动化》 2010年第3期35-37,共3页 Ordnance Industry Automation
关键词 BGA焊接 空洞 SMT BGA welding Inanition SMT
分类号 TG44 [金属学及工艺—焊接]
  • 相关文献

参考文献4

二级参考文献9

  • 1胡强.BGA的返修工艺与技术[J].电子工艺技术,2006,27(1):19-21. 被引量：11
  • 2胡强.一种适用于无铅BGA的返修方法[J].电子工艺技术,2007,28(1):14-16. 被引量：6
  • 3Primavera A A, Sturm R, Prasad. Factors that affect void formation in BGA assembly [G]//Proc of IPC/SMTA electronics assembly expo 1998, Providence, Rl,1998.
  • 4Keith, Bryant. Investigating Voids : Does a connection exist between pad finish and voiding in lead free assemblies? [ J ]. Circuit assembly, 2004 ( 6 ) : 18 - 20.
  • 5Lee Ning - cheng. Reflow soldering process and troubleshooting: SMT, BGA, CSP and Flip Chip technologies [ M ]. Butterworth - heinemann (A member of the reed elsevier group) ,2002.
  • 6IPC. IPC -7095A design and assembly process implementation for BGAs [ S ].
  • 7王彩萍.BGA的返修.表面贴装技术,2000,(2):19-21.
  • 8Cheng Yah, Qing -hua Qin,Yin -wing Mai. Nonliear analysis of plastic ball grid array solder joints [ J ]. Journal of materials science,2001,667 - 673.
  • 9Fangjuan Qi, Jim Liu. Research on failure modes of BGA assemblies with lead - free solder on difference PCB materials [ J ]. Fifth international conference on electronic packaging technology ,2003, 396 - 400.

共引文献43

同被引文献10

  • 1Zhang S, Kim S H, Kim T W, et al. A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-board Assembly Applications Using Ultrasonic Bonding [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(1): 9-14.
  • 2Khor C Y, Abdullah M Z, Leong W C. Fluid/ Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging [ J ]. IEEE Transactions on Components, Packaging and Manufacturing Tech- nology, 2012, 2(4): 604-616.
  • 3Tower S C, Su B Z, Lee Y C. Yield Prediction for Flip-chip Solder Assemblies Based on Solder Shape Modeling [J]. IEEE Transactions on Electronics Packaging Manufacturing, 1999, 22(1): 29-37.
  • 4胡姜文,潘华强,郑锐,等.0.35mm间隙BGAItE量组装工艺探讨[C]//20]4中国高端SMT学术会议论文集.宁波,2014:144-150.
  • 5Heinrich S M, Schaefer M, Schroeder S A, et al. Prediction of Solder Joint Geometries in Array type Interconnects[J]. Journal of Electronic Packaging, 1996, 118: 114-121.
  • 6Finn R. Equilibrium Capillary Surfaces[M]. Berlin: Springer-Verlag, 1986.
  • 7桂晟偲,刘佳.BGA空洞控制的回归分析研究[J].电子工艺技术,2011,32(3):148-151. 被引量：4
  • 8李朝林.BGA无铅焊点零空洞缺陷控制研究[J].半导体技术,2011,36(12):972-975. 被引量：2
  • 9王会芬,谢晓峰,吴金昌.BGA焊点气泡的分布与原因探讨[J].电子工艺技术,2013,34(2):96-99. 被引量：6
  • 10吴军.BGA焊点空洞问题分析[J].电子工艺技术,2013,34(4):223-225. 被引量：6

引证文献3

二级引证文献5

兵工自动化
2010年 第3期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部