磁约束磁控溅射源的磁场设计

Magnetic design of magnetic constraint magnetron sputtering source

磁控溅射镀膜机中的磁场分布对靶材利用率有着重要影响。为了提高磁控溅射源的靶材利用率,设计组抛弃了传统的"跑道环"形式的磁场设计理念,而是将永磁体或电磁体分置溅射靶的两侧,使其在溅射靶表面上方产生磁约束(磁镜)磁场。本设计使用有限元分析方法对磁场进行仿真计算,通过模拟磁场计算结果和实测结果的比较,验证有限元方法的可靠性。Ansys有限元分析软件对磁场分布进行仿真模拟,大大简化了计算并缩短了设计周期。通过实验验证,磁约束磁场大大提高了靶材的利用率。

The magnetic field distribution of magnetron sputtering coating equipment has a serious effect on film coating.In order to improve the utilization ratio of target of magnetron sputtering source,we abandoned the traditional ＂ring＂ forms of magnetic field runway design concept,and put permanent magnets or electromagnet separation sputtering on both sides of the target,which generated magnetic constraints（magnetic mirror） field on the target surface.This design used finite element analysis method for magnetic field simulation calculation,and the reliability of the finite element method was verified by simulation results and measured results of magnetic field.Ansys finite element analysis software was used for magnetic field distribution simulation,calculation was simplified and design cycle was reduced.Experiment indicates that the constraint magnetic field can greatly improve the utilization ratio of target.