铝合金表面Ni-Cu-P化学镀层的性能研究

Study on the properties of the Ni-Cu-P deposit on Al substrate

试验分析了铜离子浓度c(Cu2+)对沉积速度、镀液稳定性以及镀层结构与性能的影响.用SEM、XRD、VSM表征镀层的表面形貌、组织结构及磁性能.Ni-Cu-P镀层的结晶性随c(Cu2+)增加而提高,并出现明显的衍射峰位角移现象.反应激活能随pH值增加而减小,随c(Cu2+)增加而增加.500℃保温2 h,Ni-Cu-P合金发生晶化转变,出现Ni3P、Cu3P结晶相.Cu元素的加入,使得Ni-Cu-P镀层具有高的热稳定性以及低的残磁性.

By the experiments, we analyzed the influence of copper ionic concentration c （ Cu^2＋ ） on deposition rates, stability of plating baths, structures and characteristics of the deposits. SEM, XRD and VSM were used respectively to study the surface morphologies, structures and magnetic characteristics. Increasing in c（ Cu^2＋ ） improved crystalline of the Ni-Cu-P deposits, and obvious moving of diffraction peaks tending to small angles appeared. Increasing in the pH values or decreasing in c（ Cu^2＋ ） can lead to rising of the activation energies. After heat preserving for 2 hours under 500℃, crystallization transformation The addition Cu element led of Ni-Cu-P deposits was observed, appearing Ni3 P, Cu3 P crystal phases the Ni-Cu-P deposits a high thermal stability and low remanence.