Anti-CAF印制电路板的加工工艺研究

Research on Anti-CAF PCB Manufacturing

文章简单介绍了PCB中离子迁移发生的原理以及影响Anti-CAF印制电路板耐离子迁移能力的因素,着重讨论了PCB制程中内层线路质量、黑化、层压、钻孔、Desmear参数以及排板结构对Anti-CAF印制电路板耐离子迁移能力的影响,得出了最佳的工艺参数及最优的排板结构,并在此基础上对比研究了四家供应商耐CAF板料的耐离子迁移的能力,得出了耐CAF性能最佳的耐CAF板料,为公司选用耐CAF板料提供了参考。

This paper briefly describes the mechanism and influence factors of CAF （Conductive Anodic Filament） in PCB. The influence factors on Anti-CAF ability in PCB manufacturing process were discussed, such as： the inner line quality, black oxide treatment, lamination, drilling, desmear parameters, lay-up structure and so on. At the same time, Anti-CAF ability of four types of Anti-CAF materials from different suppliers was analyzed and compared. We can draw a conclusion that the Anti-CAF ability of PCB was closely related to the material itself.