摘要
文章综述了当前电子组装业中导电胶粘剂的研究情况，主要介绍国外正在重点研究的几大类导电胶粘剂及其组成，与传统锡铅焊料的对比，以及它们的电性能、机械性能、热性能等。同时简要介绍其发展趋势。
This paper introduces the research situation of conductive adhesives for microelectronics packing. Several typical conductive adhesives are focused, more attention is paid to their components, electrical performance, mechanical performance, thermal performance. And as replacement of conventional tin-lead solder, comparison between them is done. The development trend is also briefly reviewed.
出处
《印制电路信息》
2010年第3期57-59,共3页
Printed Circuit Information
关键词
导电胶粘剂
电子组装
研究现状
conductive adhesives
microelectronics packing
research situation
