摘要
用超高真空蒸发Al膜,结合氮化后处理工艺在Si(100)衬底上制备了AlN晶态薄膜。用X射线衍射(XRD)、傅立叶变换红外光谱(FTIR)和X射线光电子能谱(XPS)等测试分析技术研究了薄膜的微结构特征。结果表明:经过10000C30分钟氮化处理后,能形成具有(002)择优取向的AlN薄膜。
Owing to many outstanding properties, aluminum nitride has attracted considerable attention. In this paper, AlN thin films have been grown on Si(100) substrates by UHV electron beam evaporation of Al followed by nitridation. XRD, FTIR and XPS are employed to characterize AlN films. Results indicated that the deposited aluminum films with thickness of 200nm has completely reacted with nitrogen after nitridation at 1000 0C for 30 minutes and the AlN films with the preferred orientation of (002) are obtained.
出处
《功能材料与器件学报》
CAS
CSCD
1998年第4期277-280,共4页
Journal of Functional Materials and Devices
关键词
氮化铝
电子束蒸发
氮化
薄膜
半导体
Aluminum nitride, Electron beam evaporation, Nitridation