UV-LIGA镍薄膜材料的力学性能测试与分析

Measurement and analysis of mechanical properties of UV-LIGA Ni thin film

利用LIGA或UV-LIGA技术制备的镍,特别适合作为微器件的结构材料。材料的力学性能在微器件的仿真设计和实际使用中起到重要作用。主要利用常规的力学试验机和自行搭建的微拉伸平台,通过单轴拉伸方法测试了电流密度为20mA/cm2的UV-LIGA镍薄膜的力学性能。3种测试方法的结果呈现了一致的规律性变化——弹性模量显著降低,强度显著提高,表明UV-LIGA镍具有与块体镍显著不同的力学性能。通过X射线衍射分析(XRD),测量了该电流密度下试样的择优取向和晶粒尺寸,通过场发射扫描电镜(SEM)观察了试样的表面形貌和拉伸断口,并初步地分析了UV-LIGA镍力学性能的变化原因。该测试结果为微器件的仿真设计提供了重要的参考依据。

Electrodeposited Ni fabricated by LIGA or UV-LIGA,particularly suitable for micro-devices as a structural material.Mechanical properties of materials play an important role in micro-devices design,simulation and the actual use.In this paper,by the use of conventional mechanical testing machine and self-built micro-tensile platform,through a method of uniaxial tensile test,we measured mechanical properties of the UV-LIGA Ni thin films deposited with a current density of 20mA/cm^2.The results of three test methods showed a consistent change-and elasticity modulus dramatically reduced while strength significantly increased,indicating that UV-LIGA Ni has significantly different mechanical properties comparing with bulk Ni.Through X-ray diffraction spectrum analysis（XRD）,we measured the preferred orientation and grain size of the specimen,by field emission scanning electron microscope（SEM）,we observed the surface morphology and tensile fracture surface of the specimen and preliminarily analyzed the causes of change in mechanical properties of UV-LIGA Ni.The test results provide an important frame of reference for the design and simulation of the micro-devices.