摘要
介绍了应用最小能量原理对球栅阵列(BGA)器件焊点建立三维形态预测模型,以及利用有限元方法分析不同形态焊点在热循环条件下的应力应变分布特征.基于分析结果对三种不同引脚中心距的BGA进行组装工艺优化设计,通过环境筛选试验的验证,考核了工艺设计的可靠度.证明热应力交变下,焊点内部疲劳损伤现象与理论预测一致,有限元分析(FEA)在焊点可靠性研究中是一种有效的途径.
This paper develops 3-D shape predicting model of BGA through minimal energy principle, analyses stress distributing characteristic of different shape raider joint under thermal cycle. Based on analysis result, assembly technology is optimized of three kind of BGA with different lead center distance. Validated by environment screen testing, technical dising reliability is examined. The result indicates that, solder joint inner fatigue failure phenomenon is consistent with theory prediction under thermal stress, finite element analysis is an effective in solder joint reliability research.
出处
《微电子学与计算机》
CSCD
北大核心
2010年第3期113-118,共6页
Microelectronics & Computer
基金
国防预先研究基金项目(20024210506-5-04)
关键词
球栅阵列
焊点形态
最小能量原理
有限元分析
ball grid array （BGA）
solder joint shapes
minimal energy principl
finite element analysis （FEA）
