废弃电路板THD元器件拆除工艺的试验研究

Experimental research on the dismantling craft of THDs on waste PCBs

电子元器件的拆除对于废弃电路板的回收处理具有重要意义，文章针对利用液体加热介质拆除通孔插装元器件的过程，通过均匀设计方法安排试验，利用逐步非线性回归、通径分析和等值线图，研究了拆除过程中加热温度和时间2个最重要的因素，建立拆除工艺模型，分析最优工艺参数。结果表明，在220－260℃温度范围内，拆除THD元器件的最优工艺参数为250℃和48s。

The disassembly of electronic components is of great significance to recycling of waste prin- ted circuit boards. The dismantling process of THDs using hot liquid as the heating medium is ar- ranged in the experiment by means of uniform design. By using stepwise nonlinear regression, path a- nalysis and contour charts, two important factors--temperature and time are researched, a quadratic polynomial model is constructed and the optimum processing parameters are analyzed. The result shows that the optimum temperature and time for the dismantling craft of THDs on waste PCBs were 250 ℃ and 48 s with the temoerature ranged from 220 ℃ to 260 ℃.