摘要
介绍了焊膏印刷质量的常用检测方法,分析了二维检测和三维检测的区别和用途,阐述了如何利用检测数据和在SMT制造过程中焊膏印刷质量检测必须达到的要求。
This paper specifies the quality testing methods in solder paste printing. Automated laser detection method and automatic on-line detection method are introduced. The difference between these two inspect methods and their applications the quality inspection requirement for solder paste printing in SMT process, described is proposed.
出处
《丝网印刷》
2010年第2期11-14,共4页
Screen Printing
关键词
焊膏
印刷
检测
AOI
solder paste
inspection
quality control
screen printing
