摘要
随着SiP系统集成封装越来越广泛的应用,SiP在ATE上的测试面临诸多挑战。通过各种Module的灵活搭配,ADVANTEST T2000测试系统可以提供针对SiP芯片级封装的各个die/chip的功能特性测试,在一个测试平台上完成整个测试的解决方案。并且T2000架构凭借灵活的开放式框架,丰富的测试资源,高效的并行测试构架,人性化的操作界面,以及先进的测试理念为SiP测试提供了更好的低成本解决方案。
The ever-broadening applications of SiP devices give more and more challenges to SiP devices＇ ATE testing. Via flexible combination of variable Modules, ADVANTEST T2000 Test System can easily offer the whole testing solution aiming at different function characteristic test for SIP device. Furthermore, through flexible and open framework, abundant testing resource, highly efficient parallel test architecture, humanized operation interface and advanced testing concepts, T2000 provides better low-cost solution for SiP testing.
出处
《电子工业专用设备》
2010年第3期39-42,46,共5页
Equipment for Electronic Products Manufacturing
