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LED金线键合工艺的质量控制 被引量：5

LED Wire Bonding Technology Quality Control
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摘要 文章介绍LED引线键合的工艺技术参数和要求和相关产品质量管控规范,讨论了劈刀、金线等工具和原材料对键合质量的影响。 This article describes LED wire bonding technology and key parameters of bonding bail and loop. the product specification of quality control. Discussed capillary gold wire and other tools and materials how to affects bonding quality.
作者 斯芳虎
机构地区 厦门三安光电科技有限公司
出处 《电子质量》 2010年第3期44-45,48,共3页 Electronics Quality
关键词 LED发光二极管 键合金丝 键合功率 劈刀 引线支架 LED （Light Emitting Diode） Gold Bonding wire Bonding power Caoillary ,Lead-frame
分类号 TN312.8 [电子电信—物理电子学]
  • 相关文献

参考文献3

二级参考文献24

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  • 2范柱子,陈学东,姜伟.IC引线键合引线轮廓成形仿真研究[J].机械与电子,2005,23(5):59-62. 被引量：6
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  • 7QIN W,COHEN I M,AYYASWAMY P S.Ball size and HAZ as functions of EFO parameters for gold bonding wire[C]//Proc of the Advances in Electronic Packaging.Semiconductor Technology Vol.31 No.11 831ASME,New York,1997:391-398.
  • 8TAY A A O,SEAH B C,ONG S H.Finite element simulation of wire looping during wirebonding.[C]//Proceedings of the Advances in Electronic Packaging New York,1997(ASME):399-406
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共引文献22

同被引文献49

  • 1谭训彦,王昕,尹衍升,刘英才,张金升,孟繁琴.α-Al_2O_3的晶体结构与价电子结构[J].中国有色金属学报,2002,12(z1):18-23. 被引量：25
  • 2王垚浩,余彬海,李舜勉.功率LED芯片键合材料对器件热特性影响的分析与仿真[J].佛山科学技术学院学报（自然科学版）,2005,23(4):14-17. 被引量：20
  • 3冯武卫,范虹,孟庆丰,董光能.引线键合系统键合工具振动特性研究[J].振动与冲击,2007,26(7):106-110. 被引量：2
  • 4廉大桢.LED外延片及芯片产品的质量控制[J]半导体技术,2010(增刊):191-193.
  • 5Breach C D, Wulff F. New observations on intermetallic compound formation in gold ball bonds: General growth patterns and identification of two forms of Au4AI[J]. Mi- croelectronics Reliability, 2004,44 (6) : 973.
  • 6Goh K S, Zhong Z W. A new bonding-tool solution to im- prove stitch bondability[J]. Microelectronic Eng, 2007, 84 (1) :173.
  • 7Tee T Y, Ng H S, Yap D. Board level solder joint reliabili- ty modeling and testing of TFBGA packages for telecommu- nication applications[J]. Microeleetronics Reliability, 2003, 43(7):1117.
  • 8Goh K S, Zhong Z W. Two capillary solutions for ultra- fine-pitch wire bonding and insulated wire bonding[J]. Mi- croelectronic Eng, 2007,84 (2) : 362.
  • 9Oldervoll F, Strisland F. Wire bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures[J]. Microelectronics Reliability, 2004,44 (6) :1009.
  • 10Liu P S, Tong L Y, Wang J L, et al. Challenges and deve- lopments of copper wire bonding technology[J]. Microelec- tronics Reliability, 2012,52(6) : 1092.

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电子质量
2010年 第3期

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