摘要
LED芯片结温的高低直接影响其出光效率、工作寿命和可靠性。在分析系统各个环节热阻的基础上,详细评述了高功率LED产品从芯片到系统级的热管理研究新动向,包括:自然对流冷却,采用压电风扇、电离方法所进行的强迫空气对流冷却,采用水、液态金属作为冷却工质的液冷方法,采用热管实现的相变冷却,采用热电片进行的固态冷却方案以及利用热电片对余热进行回收利用的热管热回收方案和液体金属冷却方法。并在上述基础上提出了发展更高功率密度LED热管理方法的关键科学问题。
The temperature of the LED chip directly influences its light-emitting efficiency, working life and reliability. Through interpretation on thermoresistance Of each component, several latest thermal management methods ranging from chip to system level for the high-power LED products are comprehensively reviewed, such as natural convective cooling, forced convective cooling based on piezoelectric fan and ionization approach, liquid cooling using water and liquid metal as coolant, two phase fluid cooling via heat pipe, solid cooling schemes with thermoelectric device and the heat recycle strategy using thermoelectric device to convert waste heat to electricity and thus power the active cooling system. On the basis of above-mentioned cooling schemes, several key problems in the thermal management of high power LED products are summarized.
出处
《半导体光电》
CAS
CSCD
北大核心
2010年第1期8-15,共8页
Semiconductor Optoelectronics
关键词
高功率密度LED
热管理
自然对流
压电风扇
离子风
水冷
液态金属
热管
热电片
余热回收
high power LED
thermal management
natural convection
piezoelectric fan
ionic wind
liquid cooling
liquid metal
heat pipe
thermoelectric device
heat recycle
